Thermal management innovation in data centers: Application and analysis of pump-driven two-phase dual-loop cooling technology

This paper proposes a technical solution that combines pump-driven two-phase chip-level cold plate liquid cooling with cabinet-level backplane liquid cooling, and presents a demonstration application case. In this demonstration case, perfluorinated compounds are used as the cooling working fluids on both the primary and secondary sides in the technical solution, effectively avoiding the risks associated with water entering the equipment room and the complexity of water-cooling system maintenance. For the pump-driven two-phase chip-level cold plate liquid cooling cycle, a dry cooler is employed for outdoor cooling, eliminating the need for a cooling tower. The test results indicate that even when the outdoor ambient temperature reaches 30 ℃, the partial power usage effectiveness (pPUE) of the system can still be maintained below 1.25. The successful deployment of this innovative technology opens up a brand-new path for thermal management in green data centers and provides technical support for achieving low-carbon and efficient operation of data centers.